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2025 Vol.16, Issue 2 Preview Page

General Article

Valorizing smelted waste printed circuit board (wpcb) slag powder for cement mortars: A Particle packing approach
Hajarath Katukuri1
,
Rathish Kumar Pancharathi2*
,
Pallapothu Swamy Naga Ratna Giri3
1Research Scholar, Civil Engineering Department, National Institute of Technology Warangal, Warangal-506004, Telangana, India
2Professor, Civil Engineering Department, National Institute of Technology Warangal, Warangal-506004, Telangana, India
3Assistant Professor, Civil Engineering Department, School of Engineering, SR University, Warangal-506371, Telangana, India
*Corresponding Author
30 June 2025. pp. 193-207
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Abstract

In this study, a novel Smelted Waste Printed Circuit Board (PCB) slag powder-based cement mortar was developed by replacing cement with a multi-component binder comprising ground granulated blast furnace slag (GGBS) and PCB slag powder at varying proportions (0% to 60% at 20% intervals). The optimal blend was determined as 40% cement, 40% GGBS, and 20% PCB slag powder, yielding the required strength. To enhance mortar density and reduce voids, particle gradation techniques (Modified Toufar Model and J.D. Dewar model) were utilized for fine aggregate proportioning. The MTM technique proved superior, resulting in an optimized proportion for particle sizes of 4.75 mm-1.18 mm-0.15 mm, which led to a compressive strength of 56 MPa. Notably, the 28-day strength improvement using MTM was 19.65% higher than the experimental method and 7.15% higher than JDD. Microstructural analysis exposed distinctive features of GGBS and PCB slag powder, contributing significantly to the mortar’s performance and structural integrity.

Keywords
printed circuit board (PCB) slag powder
Sustainability
Particle packing
E-waste
Strength
Microstructure
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Information
  • Publisher :Sustainable Building Research Center (ERC) Innovative Durable Building and Infrastructure Research Center
  • Publisher(Ko) :건설구조물 내구성혁신 연구센터
  • Journal Title :International Journal of Sustainable Building Technology and Urban Development
  • Volume : 16
  • No :2
  • Pages :193-207
  • Received Date : 2024-07-13
  • Accepted Date : 2025-06-01
  • DOI :https://doi.org/10.22712/susb.20250012
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